Project summary
A midsize European precision optics manufacturer engaged Zelatec to improve the slicing process for hard, brittle sapphire substrates used in miniature optical assemblies destined for global markets. The customer sought a reliable, repeatable process that would reduce scrap and fit into their existing clean-room workflow without major line changes.
Scope of work
- Delivered an appropriately sized diamond-wire slicing system and supporting fixtures, adapted for clean-room installation.
- Provided remote commissioning guidance and basic online operator training.
- Performed initial process tuning and provided concise operating notes for routine use.
Outcomes
- Lower scrap and damage: The optimized slicing process reduced substrate breakage and edge defects compared with the customer’s previous routine.
- Improved material efficiency: Smaller cutting loss and fewer rejects improved usable yield.
- Faster production ramp-up: With on-site setup and operator coaching, the customer reached stable production within weeks.
- Operational fit: The solution’s compact footprint and the provided procedures allowed easy integration into the customer’s production area with minimal disruption.
The engagement delivered practical, measurable improvements without overhauling the customer’s production line. For the customer, that meant lower per-unit cost and a steadier supply capability for international customers. For Zelatec, the project illustrated how pairing right-sized equipment with concise process support helps manufacturers scale delicate material processes reliably.
